wafer frame ring Wafer Dicing Ring Wafer Metal Frame Wafer Metal Ring Wafer Ring Frame Wafer Frame Ring
EASTAR® wafer frame ring (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is professionally designed and produced by EASTAR engineering team.
EASTAR® wafer frame rings are the preferred solution rings because they are ergonomic and can provide safe support during wafer or chip shipping and handling operations. They are featuring extremely light weight and reliable shaping performance. We have many end users of wafer producers globally around the world.
EASTAR® wafer frame ring (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is working as a circular or special shape metal ring used to protect the edges of wafers and chips, mainly used in the laser marking process of wafers to provide protection and position limit. The wafer frame ring can withstand the high temperature and energy during the UV laser marking process to prevent chip damage and edge fragmentation.
Technical parameters for EASTAR® wafer frame ring:
1. Material: Dura420/SUS420J2 stainless steel
2. Wafer frame ring thickness and sizes:
1) 06 inches
(External diameter Φ228mm/ inner diameterΦ194mm/ Thickness 1.2mm
2) 08 inches
(External diameter Φ276mm / inner diameterΦ250mm/ Thickness 1.2mm
3) 12 inches
(External diameter Φ400mm / inner diameterΦ350mm/ Thickness 1.5mm
3. Surface treatment: Mechanical Polishing/ glossy surface Ra<0.15um/matte surface Ra>0.3um/mirror surface Ra<0.05um
4. Surface Hardness: HRC48－55
5. Size tolerance: +/-0.5mm
6. Angle tolerance: 0° 30″.
7. Flatness level: ＜0.2mm
Ring shape: Inner circular shape, Inner square shape and special customized shapes. All the shapes and sizes can be customized as per the user drawing.
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228mm Yellow Wafer Frame Ring Wafer Metal Ring Frame SUS420J2 Images
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