HRC48 - 55 Wafer Metal Ring Surface Hardness Wafer Dicing Ring Frame Ring

Dura420/SUS420J2 Stainless Steel HRC48-55 Surface Hardness Wafer Dicing Ring Frame Ring ES-WFR

1.Introduction of Dura420/SUS420J2 Stainless Steel HRC48-55 Surface Hardness Wafer Dicing Ring Frame Ring ES-WFR

EASTAR® wafer frame ring (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is professionally designed and produced by EASTAR engineering team.

EASTAR® wafer frame rings are the preferred solution rings because they are ergonomic and can provide safe support during wafer or chip shipping and handling operations. They are featuring extremely light weight and reliable shaping performance. We have many end users of wafer producers globally around the world.

2. Application of Dura420/SUS420J2 Stainless Steel HRC48-55 Surface Hardness Wafer Dicing Ring Frame Ring ES-WFR

EASTAR® wafer frame ring (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is working as a circular or special shape metal ring used to protect the edges of wafers and chips, mainly used in the laser marking process of wafers to provide protection and position limit. The wafer frame ring can withstand the high temperature and energy during the UV laser marking process to prevent chip damage and edge fragmentation.

3.Technical Parameters of Dura420/SUS420J2 Stainless Steel HRC48-55 Surface Hardness Wafer Dicing Ring Frame Ring ES-WFR

1. Material: Dura420/SUS420J2 stainless steel

2. Wafer frame ring thickness and sizes:

1) 06 inches

(External diameter Φ228mm/ inner diameterΦ194mm/ Thickness 1.2mm
2) 08 inches

(External diameter Φ276mm / inner diameterΦ250mm/ Thickness 1.2mm
3) 12 inches

(External diameter Φ400mm / inner diameterΦ350mm/ Thickness 1.5mm

3. Surface treatment: Mechanical Polishing/ glossy surface Ra<0.15um/matte surface Ra>0.3um/mirror surface Ra<0.05um

4. Surface Hardness: HRC48－55

5. Size tolerance: +/-0.5mm

6. Angle tolerance: 0° 30″.

7. Flatness level: ＜0.2mm

Ring shape: Inner circular shape, Inner square shape and special customized shapes. All the shapes and sizes can be customized as per the user drawing.

HRC48 Wafer Metal Ring

HRC55 Wafer Metal Ring

Inner circular Wafer Dicing Ring

HRC48 - 55 Wafer Metal Ring Surface Hardness Wafer Dicing Ring Frame Ring Images